On the 16th, the 26th China Hi-Tech Fair (CHTF), a three-day event, successfully concluded. Known as "China's premier science and technology exhibition," the fair attracted nearly 5,000 companies and international organizations from over 100 countries and regions. The total number of professional visitors exceeded 400,000. The intended transaction amount, including on-site deals, investments, and financing, surpassed 120 billion yuan, setting a new historical record.

This year's CHTFfeatured 17 major industries and 22 specialized exhibition areas, showcasing over 4,300 new products and innovations. A total of 869 supply-demand matching projects were signed on-site, and more than 160 major events were held, highlighting the vibrant momentum of China's technology innovation. The organizing committee also actively expanded its international reach, attracting tech companies, research institutions, and trade associations from countries and regions along the Belt and Road, including Spain, iran, the Czech Republic, and Russia, to present their innovative achievements.

This year's fair organized a "Global Buyers Matching Conference," with a tailored one-on-one invitation program for key buyers. Over 1,000 professional purchasing groups and more than 3,000 investment and financing institutions participated in on-site meetings. On the domestic side, well-known companies such as China Mobile, huawei, tencent, Xiaomi, and Midea formed delegations to attend. The international buyer groups were also large in scale. For instance, the Russian purchasing group had a total procurement value of 7.3 billion yuan, while General Electric's procurement reached 12 billion yuan.

Meanwhile, this year's fair sparked a surge in investment activity in China, with over 3,000 investment and financing institutions on-site looking for projects and business opportunities. Prominent institutions such as Morgan Stanley, JPMorgan Chase, Goldman Sachs, sequoia Capital, Bain Capital, iDG Capital, and Citibank were among those participating.

In addition, shenzhen launched the "Future Tech Innovation Capsule" and initiated the "KunpengYouth Innovation and Entrepreneurship Action." the city also unveiled a risk compensation plan for the technology innovation seed fund, aimed at encouraging more young people to get involved in technological innovation.

Source: Lingnan on the Cloud

第二十六届高交会闭幕 意向成交金额突破1200亿元

16日，为期3天的第二十六届中国国际高新技术成果交易会（简称“高交会”）圆满落幕。这一享有“中国科技第一展”美誉的展会吸引了全球100多个国家和地区的近5000家企业与国际组织参展，专业观众累计突破40万人次，意向成交金额超过1200亿元（包括现场成交、投融资等），创下历史新高。

本届高交会共设置17大产业与22个专业展区，发布新产品新成果4300余项，促成869项供需对接项目现场签约，并举办重大活动160余场，展示了中国科技创新的蓬勃活力。组委会积极拓展国际化视野，吸引了西班牙、伊朗、捷克、俄罗斯等“一带一路”国家和地区的科技企业、科研机构、商协会等携创新成果参展。

本次高交会组织“全球采购商对接大会”，制定核心买家一对一邀约方案，邀请到1000多个专业采购团和3000余家投融资机构现场对接。国内采购商方面，中国移动、华为、腾讯、小米、美的等知名企业组团参会。国际采购团也规模庞大，例如俄罗斯采购团企业采购总金额达73亿元、通用电气采购金额达120亿元。

与此同时，本届高交会也掀起中国投资热潮，3000余家投融资机构现场寻找项目和商机，摩根士丹利、摩根大通、高盛集团、红杉资本、贝恩资本、IDG资本、花旗银行等多家知名投融资机构均名列其中。

此外，深圳推出“未来科创胶囊”，启动“鲲鹏青年创新创业行动”，并发布科技创新种子基金风险补偿方案，以鼓励更多青年参与科技创新。

文｜记者沈婷婷
图｜王磊
译｜林佳岱
审｜赵凡