Held at the Shenzhen Convention & Exhibition Center (Futian) from October 14th to 16th, WESEMiBAY Semiconductor Ecosystem Expo 2026 covers a total exhibition area of nearly 80,000 square meters, representing a year-on-year increase of 30%. The expo hosts over 1,000 participating enterprises, up 66% year on year. It features more than 40 industrial forums and over 30 targeted matchmaking sessions, with 43 core Fab manufacturers specially invited. The event brings together key players in the semiconductor industry from 22 countries and regions, with more than 70 international exhibitors in attendance.

Based on the Greater Bay Area's robust application scenarios including smart terminals, automotive electronics, AI industries and the low-altitude economy, the expo launches the new AI Infrastructure Ecosystem Expo (AIE), building a complete industrial chain loop covering chips, computing power and end applications.

Co-hosted with the international academic journal "Chip", which publishes innovative research in the emerging field of integrated chips, the expo holds the WESEMiBAY Integrated Circuit Science & Technology Conference. The conference brings together multiple members of the Chinese Academy of Sciences, representatives from over 50 universities and 150 top leading scholars. It releases the "Top 10 Scientific Advances of 2025 in China", selected by 69 experts from 14 countries. Academic experts from Tsinghua University, Peking University, Shanghai Jiao Tong University, Shenzhen University and other universities share cutting-edge scientific and technological achievements.

Officials from the Shenzhen Stock Exchange and Shanghai Stock Exchange deliver on-site policy briefings. During the expo period, industry white papers and supply-demand research reports will be released, and multiple major industrial project signing ceremonies will be launched.

Adhering to a "four-in-one" ecosystem integrating industry, technology, capital and talent, the expo links major domestic semiconductor industrial clusters with key industrial zones in Shenzhen. It establishes a regular dialogue mechanism for government, industry, academia, research institutions, end users and service providers, facilitating upstream and downstream collaboration as well as integrated production, supply and sales across the industrial chain.

2026湾区半导体产业生态博览会开幕 全球“芯”势力汇聚深圳

10月14日至16日，2026湾区半导体产业生态博览会在深圳会展中心（福田）举行。本届湾芯展展览规模近8万平方米，同比增长30%；1000余家企业参展，同比增长66%；举办40余场产业论坛、30余场专项对接会，定向邀约43家核心Fab制造企业。展会汇聚22个国家和地区的半导体核心力量，70余家国际展商亮相。

展会依托大湾区智能终端、汽车电子、AI产业、低空经济等应用场景，新增AIE AI基础设施产业生态展，打通“芯片—算力—应用”产业闭环。

湾芯展联合芯片领域学术期刊《Chip》举办湾区集成电路科学技术大会，集结多位中国科学院院士、50余所高校、150位顶尖学者，发布由14国69位专家遴选的Chip 2025年度中国芯片科学十大进展。清华、北大、上海交大、深圳大学等高校专家分享前沿科研成果。

深交所、上交所等机构现场开展政策宣讲。展会期间将发布产业白皮书、供需调研报告，落地多场重大产业项目签约活动。

本届湾芯展坚持“产业+技术+资本+人才”四位一体生态共建思路，联动国内各大半导体产业集群城市与深圳本地重点产业片区，搭建政产学研用服常态化对话渠道，推动上下游协同、产供销贯通。

文｜记者 李晓旭
图｜记者 王磊
译｜郑书悦
审｜盛嘉