On October 13th, CanSemi Technology Inc. made its debut on the ChiNext Board of the Shenzhen Stock Exchange, with an IPO price of 12.01 yuan per share. The initial public offering (IPO) comprised 513 million shares. If the overallotment option is exercised in full, the total number of shares offered would expand to 590 million, raising gross proceeds of up to 7.08 billion yuan.As Guangdong's first homegrown 12-inch wafer manufacturer to achieve mass production, CanSemi is headquartered in Guangzhou's Huangpu District and widely acclaimed as "Guangzhou's first chip." Starting with mature nodes, the company focuses on sectors heavily reliant on imports, such as analog chips, sensors, and power semiconductors. The launch of its Phase I production line in 2019 ended Guangdong's lack of a homegrown 12-inch wafer fab in mass production.

On January 22nd, CanSemi launched its Phase IV project with a total investment of 25.2 billion yuan. The project involves building a 12-inch mixed-signal specialty process production line with a monthly capacity of 40,000 wafers, scheduled to be completed and put into operation by the end of 2029. Upon completion, the combined capacity of its three plants will reach 120,000 wafers per month, creating South China's largest 12-inch wafer manufacturing cluster.

Driven by CanSemi, the Guangzhou Development District and Huangpu District are now home to over 150 integrated circuit enterprises, generating an output value exceeding 34 billion yuan in 2025—a year-on-year increase of 17.1%—and forming a complete closed-loop ecosystem covering chip design, wafer manufacturing, packaging and testing, equipment and materials, and terminal applications.

Backed by provincial government guidance funds, local state-owned capital platforms, and industrial capital, CanSemi exemplifies Guangdong's endeavor to build China's third major chip hub for the integrated circuit industry.

粤芯上市托起广东“第三极” 一颗“广州芯”带出一条链

10月13日，粤芯半导体登陆深交所创业板，发行价格为12.01元/股。IPO初始发行5.13亿股，超额配售选择权全额行使后，发行总股数扩大至5.9亿股，募资总额最高可达70.8亿元。

粤芯半导体是广东自主培育、首家实现量产的12英寸晶圆制造企业，总部位于广州黄埔，被誉为“广州第一芯”。公司从成熟制程切入，专注模拟芯片、传感器、功率半导体等国产化率较低领域。2019年一期产线量产，改写广东无本土12英寸量产晶圆厂格局。

1月22日，粤芯半导体四期项目启动，总投资252亿元，规划建设月产能4万片的12英寸数模混合特色工艺生产线，预计2029年底建成投产。建成后，三座工厂总产能将达12万片/月，成为华南地区规模最大的12英寸晶圆制造集群。

在广州开发区、黄埔区，受粤芯带动，目前区内已集聚集成电路企业超150家，2025年实现产值超340亿元、同比增长17.1%，覆盖“芯片设计－晶圆制造－封装测试－设备材料－终端应用”完整闭环。

粤芯半导体背后有省级政府引导基金、地方国资平台及产业资本共同托举，是广东打造中国集成电路产业“第三极”的样本。

文｜记者 黄婷
图｜羊城晚报资料图
翻译｜徐芷晴
审校｜郑奕玲